Polymers in Electronic Packaging - Two Day Short Course
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Polymers in Electronic Packaging - Two Day Short Course

 Export to Your Calendar 11/4/2019 to 11/5/2019
When: Monday, November 4, 2019
Where: United States
Contact: Jennifer Hoffman

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The Golden Gate Polymer Forum (GGPF) and ASM International, Santa Clara Valley Chapter, announce a 2-day short course on November 4 and 5, 2019 in Mountain View, CA. This course will be delivered by Dr. Jeff Gotro and Dr. Bruce Prime, experts in the field of thermosetting polymers and processes. It will provide an overview of polymers and the important structure-property-process-performance relationships for thermosets with emphasis on electronic packaging. In the context of this short course, electronic packaging comprises the materials and structures used to connect the finished semiconductor chip with other electronic components (such as memory chips, camera modules, displays, etc.). Some examples are die attach adhesives, underfills, polymer dielectric redistribution layers, encapsulants, semiconductor substrates, and high density printed circuit boards. The focus will be on the broad types of thermosetting polymers and processes used in electronic packaging. Course sponsors will have the opportunity to display their product lines and exhibit the latest tools for thermoset characterization. This course is geared toward technical professionals with backgrounds in chemistry, engineering, or materials science. 

Click here to view the June Newsletter.


 
For more information contact Jennifer Hoffman at jmchoff@gmail.com (GGPF) or Jason James at jasjam1301@gmail.com (ASM).  
 

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